点击图片查看大图Pb-FREE SOLDER PASTE TLF-SERIES LFSOLDER TLF-204-21A
LFSOLDER TLF-204-21Ais a solder paste used for mounting electronic parts on the circuit boards of
electronic equipment demanded of high reliability for long time. Furthermore, the paste will greatly contribute
to the protection of global environments as it uses Pb-free spherical solder powder of the Sn/Ag/Cu alloy. No
cleaning is required after soldering since the flux residues are free from cracks after TCT (Thermal Cycle Test).
Also the insulation is not affected by TCT.
1. Outstanding Features
l Crack resistant flux residues.
l Pb-free (Sn/Ag/Cu series) solder alloy is used.
l Excellent insulation characteristic can be obtained under the conditions of high temperature and high humidity.
l For N2 reflow.
l Having a good solderability, adequate wettability is shown on various parts.
l Stable printability is obtained with little change in viscosity during continuous printing.
l Excellent printability is obtained for fine patterns of0.4mmpitch.
2. Characteristics
Characteristics of LFSOLDER TLF-204-21Aare shown in Table 1 and Table 2.
Table 1 - Characteristics of LFSOLDER TLF-204-21A
tems | Characteristics | Test methods |
Alloy composition | Sn 96.5/ Ag 3.0/ Cu0.5 | JIS Z 3282(1999) |
Melting point | 216~220℃ | According to DSC measurement |
Particle size of solder powder | 20~41μ m | According to laser diffraction method |
Shape of solder powder | Spherical | Annex 1 to JIS Z 3284(1994) |
Flux content | 11.30% | JIS Z 3284 (1994) |
Content* | 0.00% | JIS Z 3197 (1999) |
Viscosity | 210 Pa･s | Annex 6 to JIS Z 3284(1994) Viscometer, type PCU, manufactured by Malcom, at25℃ |
*Result of examination in flux.
Table 2 – Characteristics of LFSOLDER TLF-204-21A
tems | Characteristics | Test methods |
Water solution resistance test | More than 1×104Ω ･cm | JIS Z 3197(1999) |
Insulation resistance test | More than 1×109Ω | Annex 3 to JIS Z 3284(1994) |
Slump test | Less than0.20mm | Print the paste on ceramics board and heat for 60 seconds at150℃. Measure the slumping width from before and after heating.STD-092b* |
Solder ball test | Solder balls seldom occur. | Print the paste on ceramics board. After |
Solder spread test | More than 75% | JIS Z 3197 (1986) 6.10 |
Copper plate corrosion test | No corrosion | JIS Z 3197 (1986)6.6.1 |
Tackiness test of residue | Pass | Annex 12 to JIS Z 3284(1994) |
* Test method of our company
