品牌:星光SUNKKO 7003 | 型号:SUNKKO 7003 | 类型:恒温热风枪 |
工作温度:100~250 oC | 空气流量:32~45公升/分钟 | 外形尺寸:33.5x28x19厘米(mm) |
电源类型:交流电源 | 额定电压:750W | 重量:5千克 |
工作电流:气泵: 45W膜片 | 额定输入功率:1500W | 噪音分贝:== |
是否提供加工定制:是 |
星光7003 专业智能可编程数显维修站
1) 852D+ 智能可编程拆焊器
2) 863E 红外线恒温预热台
3) 301 全方位工作平台
4) 933E 镊子焊台
SUNKKO 7003 Intelligent Programmable Digital Service Station
1) 852D+ Intelligent Programmable Rework Station
2) 863E Infrared Thermostat Preheater
3) 301 Omnipotent Work Platform
4) 933E Tweezers Soldering Station
== 特 式 / FEATURE ==
1) 独有50个灵活程序及一触式简易运作, 可作不同维修要求, 使整个返修操作获得依据而具科学性。
1) Unique total 50 flexible programs for different requirements and one touch operation. An overall operation could be formed a scientific reference.
2) 独设三段式温度曲线程序, 实践分段升温控制, 令BGA得到妥贴的保护。
2) Unique a 3 segments' temperature curve program achieves a stage heating with good protection of BGA.
3) 独设联机开启功能, 852D+拆焊机与863E预热台同步发热, 保护PCB及BGA。
3) Unique joint start with 852D+ rework station and 863E Preheater up and down heating at same step to protect PCB and BGA.
4) 独有校准笔装置, 检测热风温度及BGA表面温度。
4) Unique calibration pen is used to check the temperature of hot air produced and hot air on BGA surface.
5) 独有内置吸盘吸放组件, 满足BGA不触的特性。
5) Unique built-in BGA sucker is used to lift BGA from/on PCB to meet BGA non-touch nature.
6) 智能休眠, 自动唤醒, 自动切源及自动冷却等感应功能, 省电环保, 安全长寿。
6) Intelligent control on auto sleep, auto awake, auto power off and auto cooling for energy save, safe, long life and environment protection.
7) 配合数控温度, 时间设定及数控风量, 附气流量显示, 可准确及有效率对芯片进行返修。
7) With digital temperature setting, time setting, digital airflow setting and airflow parameter display, the performance becomes more efficiently and precisely.
8) 灵活启动键设于手柄或主板上。
8) Flexible start by handle or panel.
9) 上下同步加热效果, 配备顶部的750W热风手柄及底部的1500W预热台, 有效防止线路板变形。
9) With up and down heating formed by 750W hot air handle on the top and 1500W preheater under PCB to have overall and even heating to avoid PCB deformation.
10) 预热台的加热面积16x16cm, 适合需均匀预热的线路板或较大的组件, 备预热及冷风功能选择。
10) Preheater has large heating area 16x16cm. It is suitable for special care PCB and large assembly parts with preheat and cooling function.
11) 免持操作, 配合301工作台架的辅助, 轻易夹持不同尺寸的主板及定位简易, 方便灵活。
11) Hands free control under assistance of 301 stand which holds any size of PCB freely.
12) 933E镊子适合夹焊密集线路板上的细小组件, 绝不泱及附近组件。
12) 933E tweezers is good for soldering tiny component in a high density circuit board and does not affect the nearby components.
13) 选购专用BGA风咀, 使拆焊效果更佳及操作更快捷。
13) Fitting optional BGA nozzle ensures excellent performance and efficiently.
14) 广泛适合维修高技术电子产品, 如手机, 计算机, MP3等。
14) Suitable for hi-tech electronics products such as mobile phone, computer, MP3, etc.
== SUNKKO 852D+ ==
最高功率: 750W
Max Power: 750W
稳定功率: 300W
Steady Power: 300W
控温范围: 100~600 oC
Temperature: 100~600 oC
气流量: 0.3~24公升/分钟
Air Control: 0.3~24 L/min
控时范围: 15~999秒
Time Control: 15~999 sec
精密度: BGA表面+/-3 oC
Precision: BGA surface +/-3 oC
发热体: 700W陶瓷
Heater: 700W Ceramic
气泵: 45W膜片
Air Pump: 45W Diaphragm
真空吸力: >50 g
Vacuum Power: >50 g
机身: 185(长)245(阔)170(高)毫米
Dimension: 185(L)245(W)170(H) mm
包装: 33.5x28x19厘米
Packing: 33.5x28x19 cm
毛重: 5千克
Gross Weight: 5kg
== SUNKKO 863E ==
最高功率: 1500W
Max Power: 1500W
温度范围: 100~250 oC
Temperature: 100~250 oC
预热面积: 16x16cm
Preheat Area: 16x16cm
气流量: 32~45公升/分钟
Airflow: 32~45 L/min
控温模式: MCU, PID
Control Mode: MCU, PID
发热组件: 石英红外线
Heater: Quartz Infrared
传感器: K热电耦
Detector: K Thermocouple
包装: 33.5x28x19 cm
Packing: 33.5x28x19 cm
毛重: 3.7千克
Gross Weight: 3.7 kg
== SUNKKO 301 ==
包装: 51x41x17 cm
Packing: 51x41x17 cm
毛重: 13千克
Gross Weight: 13 kg
== SUNKKO 933E ==
最高功率: 60W
Max Power: 60W
电压输出: 24V
Voltage Output: 24V
对地电阻: <2Ω
Ground Resistance: <2Ω
对地电压: <2mv
Ground Potential: <2mv
发热芯: 50W陶瓷
Heater: 50W Ceramic
精密度: +/-1 oC
Precision: +/-1 oC
烙铁控温: 200~480 oC
Iron Temperature: 200~480 oC
镊子控温: 200~400 oC
Tweezers Temperature: 200~400 oC
包装: 27x23.5x16 cm
Packing: 27x23.5x16 cm
毛重: 3千克
Gross Weight: 3 kg
1) 852D+ 智能可编程拆焊器
2) 863E 红外线恒温预热台
3) 301 全方位工作平台
4) 933E 镊子焊台
SUNKKO 7003 Intelligent Programmable Digital Service Station
1) 852D+ Intelligent Programmable Rework Station
2) 863E Infrared Thermostat Preheater
3) 301 Omnipotent Work Platform
4) 933E Tweezers Soldering Station
== 特 式 / FEATURE ==
1) 独有50个灵活程序及一触式简易运作, 可作不同维修要求, 使整个返修操作获得依据而具科学性。
1) Unique total 50 flexible programs for different requirements and one touch operation. An overall operation could be formed a scientific reference.
2) 独设三段式温度曲线程序, 实践分段升温控制, 令BGA得到妥贴的保护。
2) Unique a 3 segments' temperature curve program achieves a stage heating with good protection of BGA.
3) 独设联机开启功能, 852D+拆焊机与863E预热台同步发热, 保护PCB及BGA。
3) Unique joint start with 852D+ rework station and 863E Preheater up and down heating at same step to protect PCB and BGA.
4) 独有校准笔装置, 检测热风温度及BGA表面温度。
4) Unique calibration pen is used to check the temperature of hot air produced and hot air on BGA surface.
5) 独有内置吸盘吸放组件, 满足BGA不触的特性。
5) Unique built-in BGA sucker is used to lift BGA from/on PCB to meet BGA non-touch nature.
6) 智能休眠, 自动唤醒, 自动切源及自动冷却等感应功能, 省电环保, 安全长寿。
6) Intelligent control on auto sleep, auto awake, auto power off and auto cooling for energy save, safe, long life and environment protection.
7) 配合数控温度, 时间设定及数控风量, 附气流量显示, 可准确及有效率对芯片进行返修。
7) With digital temperature setting, time setting, digital airflow setting and airflow parameter display, the performance becomes more efficiently and precisely.
8) 灵活启动键设于手柄或主板上。
8) Flexible start by handle or panel.
9) 上下同步加热效果, 配备顶部的750W热风手柄及底部的1500W预热台, 有效防止线路板变形。
9) With up and down heating formed by 750W hot air handle on the top and 1500W preheater under PCB to have overall and even heating to avoid PCB deformation.
10) 预热台的加热面积16x16cm, 适合需均匀预热的线路板或较大的组件, 备预热及冷风功能选择。
10) Preheater has large heating area 16x16cm. It is suitable for special care PCB and large assembly parts with preheat and cooling function.
11) 免持操作, 配合301工作台架的辅助, 轻易夹持不同尺寸的主板及定位简易, 方便灵活。
11) Hands free control under assistance of 301 stand which holds any size of PCB freely.
12) 933E镊子适合夹焊密集线路板上的细小组件, 绝不泱及附近组件。
12) 933E tweezers is good for soldering tiny component in a high density circuit board and does not affect the nearby components.
13) 选购专用BGA风咀, 使拆焊效果更佳及操作更快捷。
13) Fitting optional BGA nozzle ensures excellent performance and efficiently.
14) 广泛适合维修高技术电子产品, 如手机, 计算机, MP3等。
14) Suitable for hi-tech electronics products such as mobile phone, computer, MP3, etc.
== SUNKKO 852D+ ==
最高功率: 750W
Max Power: 750W
稳定功率: 300W
Steady Power: 300W
控温范围: 100~600 oC
Temperature: 100~600 oC
气流量: 0.3~24公升/分钟
Air Control: 0.3~24 L/min
控时范围: 15~999秒
Time Control: 15~999 sec
精密度: BGA表面+/-3 oC
Precision: BGA surface +/-3 oC
发热体: 700W陶瓷
Heater: 700W Ceramic
气泵: 45W膜片
Air Pump: 45W Diaphragm
真空吸力: >50 g
Vacuum Power: >50 g
机身: 185(长)245(阔)170(高)毫米
Dimension: 185(L)245(W)170(H) mm
包装: 33.5x28x19厘米
Packing: 33.5x28x19 cm
毛重: 5千克
Gross Weight: 5kg
== SUNKKO 863E ==
最高功率: 1500W
Max Power: 1500W
温度范围: 100~250 oC
Temperature: 100~250 oC
预热面积: 16x16cm
Preheat Area: 16x16cm
气流量: 32~45公升/分钟
Airflow: 32~45 L/min
控温模式: MCU, PID
Control Mode: MCU, PID
发热组件: 石英红外线
Heater: Quartz Infrared
传感器: K热电耦
Detector: K Thermocouple
包装: 33.5x28x19 cm
Packing: 33.5x28x19 cm
毛重: 3.7千克
Gross Weight: 3.7 kg
== SUNKKO 301 ==
包装: 51x41x17 cm
Packing: 51x41x17 cm
毛重: 13千克
Gross Weight: 13 kg
== SUNKKO 933E ==
最高功率: 60W
Max Power: 60W
电压输出: 24V
Voltage Output: 24V
对地电阻: <2Ω
Ground Resistance: <2Ω
对地电压: <2mv
Ground Potential: <2mv
发热芯: 50W陶瓷
Heater: 50W Ceramic
精密度: +/-1 oC
Precision: +/-1 oC
烙铁控温: 200~480 oC
Iron Temperature: 200~480 oC
镊子控温: 200~400 oC
Tweezers Temperature: 200~400 oC
包装: 27x23.5x16 cm
Packing: 27x23.5x16 cm
毛重: 3千克
Gross Weight: 3 kg
联系人:陈小姐
地址:深圳市福田区华强北振华路高科德电子市场一楼13228柜台
手机:13510141518
电话/传真:0755-83796883
QQ:516639378
E-mail:wantongchj@126.com
网址:http://www.wtgjyq.com
地址:深圳市福田区华强北振华路高科德电子市场一楼13228柜台
手机:13510141518
电话/传真:0755-83796883
QQ:516639378
E-mail:wantongchj@126.com
网址:http://www.wtgjyq.com