Application Field

Filtering between analog and digital circuitry, clock generation circuitry, I/O interconnects, isolation between RF noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted RF energy from corrupting the power generation circuitry, high frequency EMI prevention of computers, printers, VCRs, TVs and portable telephones.

Features

Combines 4 single 1608(0603) chips into one package 3216(1206) to reduce bOArd space, and placement time 0.8mm terminal pitch makes easy to apply EMI prevention in multiple-lines such as connectors and IC pins. Material and construction design minimize cross talk between adjacent circuits.

Directions

◎Impedance Range：30 to 1000 Ohms @ 100MHz

◎Operating Temperature Range：-55℃ to +125℃

◎Soldering Method：Reflow or Wave Soldering

◎Packaging Method：Tape & Reel (per EIA Specifications)

◎Storage Temperature：-40℃ to +85℃，70% RH Max