ALPHA OM-338-T is a lead-free, no-clean solder paste designed for a brOAd range of applications. ALPHA OM-338-T’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338-T yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications.
Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-T is formulated to deliver exceptional visual joint cosmetics. Additionally, ALPHA OM-338-T’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
ALPHA OM-338-T is also known as ALPHA OM-338 with M13 viscosity.

•
Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness.
•
Excellent print consistency with high process capability index across all board designs.
•
Print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput.
•
Wide reflow profile window with good solderability on various board / component finishes.
•
Excellent solder and flux cosmetics after reflow soldering
•
Reduction in random solderballing levels, minimizing rework and increasing first time yield
•
Meets highest IPC 7095 voiding performance classification of Class III.
•
Excellent reliability properties, halide-free material
•
Compatible with either nitrogen or AIr reflow

免责声明：本文所用视频、图片、文字如涉及作品版权问题，请第一时间告知，我们将根据您提供的证明材料确认版权并立即删除内容。