发布需求
北京| 加工定制: | 是 |
| 种类: | 元素半导体 |
| 特性: | 工具 |
| 用途: | 电子 |
2英寸蓝宝石切割片
2英寸蓝宝石研磨片
2英寸蓝宝石清洗封装片
单晶晶体质量指标：
蓝宝石晶体纯度≥99.996%
蓝宝石晶体内没有散射颗粒、气泡、无颜色、无包裹物、无多晶、无孪生等现象；蓝宝石晶体无小角晶，晶体定向精度小于0.1°
产品规格：
Epi-Ready Sapphire Wafer |
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Diameter |
50.8±0.1mm |
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Thickness |
430±10μm |
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Orientation |
C-plane 0.2°to M-axis ± 0.1° |
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C-plane 0°to A-axis ± 0.1° |
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Orientation flat |
16.0±1mm |
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Primary flat location |
A-axis ± 0.2° |
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Front side surface |
Epi-Ready Polished |
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Surface Roughness |
Ra＜0.2nm |
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Back side surface |
0.8—1.2μ |
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TTV |
＜10μ |
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BOW |
＜10μ |
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Package |
Clean Room，Nitrogen Atmosphere |
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研 磨片 |
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Orientation |
C-plane 0.2°to M-axis ±0.1° |
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C-plane 0°to A-axis ± 0.1° |
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Diameter |
50.8 ± 0.1mm |
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Thickness |
0.49 ± 0.05mm |
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TTV |
15um |
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Warp |
15um |
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Primary Flat |
Length |
16.0±1.0mm |
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Orientation |
A-plane±0.2° |
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Visual appearance |
No cracks，pits，edge chipping |
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切 割片 |
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Orientation |
C-plane 0.2°to M-axis ±0.1° |
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C-plane 0°to A-axis ± 0.1° |
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Diameter |
50.8± 0.1mm |
|
Thickness |
0.52 ± 0.03mm |
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TTV |
20um |
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Warp |
＜40um |
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Primary Flat |
Length |
16.0±1.0mm |
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Orientation |
A-plane±0.2° |
Visual appearance |
No cracks，pits，edge chipping |
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*定向角度可根据客户的不同需求进行定向加工。
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